STM32F401CCU6 48qfn Entegre 32 Bit Arm Cortex-M4 Risc Mcu Dsp Fpu 256 Kbytes Flash Memory 84 MHz Cpu

STM32F401CCU6 48qfn Entegre

32 Bit   Arm Cortex-M4 Risc Mcu Dsp Fpu 256 Kbytes Flash Memory 84 MHz Cpu Art Accelerator   I2C Irda LINbus Sdio Spi Uart Usb Adc Rtc

      The STM32F401CCU6 devices are based on the high-performance Arm Cortex-M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

     The STM32F401xB/STM32F401xC incorporate high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 64 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

     All devices offer one 12-bit Adc, a low-power Rtc, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.

     The STM32F401xB/STM32F401xC operate in the -40C to 125C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

Features:

• Core processor:   ARM Cortex-M4     
  
• Core size:   32-Bit     
  
• Speed:  84MHz     
  
• Connectivity:  I2C, IrDA, LINbus, SDIO, SPI, UART/USART, USB OTG     
  
• Peripherals:  Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT     
  
• Number of I/O:   36     
  
• Program memory size      256KB (256K x 8)
  
• Program memory type     Flash 
  
• Ram size      64K x 8     
  
• Voltage supply (Vcc/Vdd)     1.7V / 3.6V     
  
• Data Converters     A/D 10x12b     
  
• Oscillator type:   Internal     
  
• Operating temperature     -40C / 85C (TA)     
  
• Mounting type:   Surface Mount     
  
• Package:   48-UFQFN Exposed Pad     
  

Features:

•     Dynamic efficiency line with BAM (batch acquisition mode)
  
•         1.7 V to 3.6 V power supply
  
•         -40C to 85/105/125C temperature range
  
•     Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator ( ART Accelerator ) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  
•     Memories
  
•         Up to 256 Kbytes of Flash memory
  
•         512 bytes of OTP memory
  
•         Up to 64 Kbytes of SRAM
  
•     Clock, reset and supply management
  
•         1.7 V to 3.6 V application supply and I/Os
  
•         POR, PDR, PVD and BOR
  
•         4-to-26 MHz crystal oscillator
  
•         Internal 16 MHz factory-trimmed RC
  
•         32 kHz oscillator for RTC with calibration
  
•         Internal 32 kHz RC with calibration
  
•     Power consumption
  
•         Run: 128 μA/MHz (peripheral off)
  
•         Stop (Flash in Stop mode, fast wakeup time): 42 μA typ 25C;65 μA max 25C
  
•         Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ 25C; 28 μA max 25C
  
•         Standby: 2.4 μA 25C / 1.7 V without RTC; 12 μA  85C 1.7 V
  
•         VBAT supply for RTC: 1 uA 25C
  
•     1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
  
•     General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
  
•     Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
  
•     Debug mode
  
•         Serial wire debug (SWD) & JTAG interfaces
  
•         Cortex®-M4 Embedded Trace Macrocell
  
•     Up to 81 I/O ports with interrupt capability
  
•         All IO ports 5 V tolerant
  
•         Up to 78 fast I/Os up to 42 MHz
  
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